The authors appreciate Dr. Ligrani’s comment on the paper. The discrepancy of heat transfer enhancement on the dimpled surface reported by different investigators might be due to the use of different measurement technique for the data taken and reduction. In addition to the aforementioned studies, for example, Zhou and Acharya [15] reported that the heat transfer enhancements of the dimpled surface for nonrotation could be about 1.5–2 times the smooth channel values for a dimple depth to print diameter ratio of 0.29 by using the naphthalene sublimation mass-transfer technique. Moon and Lau 22 showed that the dimpled surface heat transfer for nonrotation enhanced about 1.6–1.8 times the smooth-channel values for the dimple depth to print diameter ratios around 0.2–0.23 by using the standard aluminum plate with heaters and thermocouples. These heat transfer enhancement ratios are close to the present study’s values for nonrotation by using the standard copper plate with...
Skip Nav Destination
Article navigation
July 2003
Technical Papers
Closure to Discussion of “Heat Transfer in Rotating Rectangular Cooling Channels (AR=4) With Dimples” (2003, ASME J. Turbomach., 125, p. 564)
J. Turbomach. Jul 2003, 125(3): 564 (1 pages)
Published Online: August 27, 2003
Article history
Online:
August 27, 2003
Citation
(August 27, 2003). "Closure to Discussion of “Heat Transfer in Rotating Rectangular Cooling Channels (AR=4) With Dimples” (2003, ASME J. Turbomach., 125, p. 564)." ASME. J. Turbomach. July 2003; 125(3): 564. https://doi.org/10.1115/1.1571852
Download citation file:
45
Views
Get Email Alerts
Cited By
Related Articles
Discussion: “Heat Transfer in Rotating Rectangular Cooling Channels (AR=4) With Dimples” (T. S. Griffith, L. Al. Hadhrami, and J.-C. Han., 2003, ASME J. Turbomach. 125 , pp. 555–563)
J. Turbomach (July,2003)
Flow Structure and Enhanced Heat Transfer in Channel Flow With
Dimpled Surfaces: Application to Heat Sinks in Microelectronic
Cooling
J. Electron. Packag (June,2007)
Erratum: “An Experimental Study of Heat Transfer of a Porous Channel Subjected to Oscillating Flow” [ASME J. Heat Transfer, 123 , No. 1, pp. 162–170]
J. Heat Transfer (December,2001)
Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube
J. Electron. Packag (June,2006)
Related Proceedings Papers
Related Chapters
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Herbie's Homework Helpers
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong